To apply to the JSP, students must:

  1. Be enrolled as a full-time student in a 4-year university in their home country, and have completed a minimum of one semester.

  2. Have a 2.5 GPA based on a 4.0 grading scale (or applicable equivalent.)

  3. Be a native English speaker -or- Have iBT 79 TOEFL, IELTS 6.0 equivalent.


See program schedule.

Forms & Documents

The following documents must be emailed as digital data to jsp@tiu.ac.jp

  1. Application form

    Available Online or as a PDF download. Our online application form uses services provided by Google, Inc. If you prefer a paper-based application, please download and print the PDF form.

  2. Proof of Enrollment

    A letter from the registrar of your college or university stating your current status and expected date of graduation.

  3. Official Transcripts

    Transcript must be form the most recently completed semester or term of your college or university and show your cumulative academic work.

  4. Two Letters of Recommendation

    Recommendations must be from faculty or administration officer of your college or university who know you well with her/his signature and date of signing. Letters must be on school letterhead. Letters may be emailed separately by each professor/administrator. Letters should address your academic ability, emotional maturity, ability to adjust to new situations, and ability to cooperate with others. Please have them include contact their information including address, telephone number, fax number and email address.

  5. Scanned Image of Your Passport

    Scanned image of the identification page of your passport.

  6. Passport-Style Digital Picture

    A digital picture of your face with a plain white background. This must match the guidelines below:

    1. Larger than 600 × 800 pixel jpeg format
    2. Upper half of torso and head without a cap and background
    3. Taken within last three months

  7. Health History Form

    Please fill out the Health History Form as a PDF download for our office file.

Mailing Address

See contact page.